Equipment Available

Electronics Yorkshire’s Technology Equipment Hire is provided primarily for SMEs to enhance their production capability and develop the competitiveness of their business.

By using this facility companies can assemble a more complex product without the problems associated with high capital investment and low site usage that usually deters SMEs from acquiring such equipment.

If you require further advice on the equipment contact Peter H Burnley, Training and Technology Centre Manager: peterb@electronicsyorkshire.org.uk.

Knowledgeable technical assistance will be on hand by arrangement for companies who require this service. Costs for hire are:

General equipment hire . . . £50 per hour; £250 per day; £750 per week
X-ray equipment hire . . . £150 per hour; £750 per day
RoHS Compliance Test . . . £35 per component/item; £240 per hour
Please contact Electronics Yorkshire for a RoHS test quotation

Full Members of Electronics Yorkshire Network receive a 20% discount off the equipment hire prices and 10% discount off RoHS compliance testing.

Brief overview of each piece of equipment

ERSA IL550 + PL 550 BGA placement systems

Places BGA and CSP devices on PCBs on small batch or rework using infra-red.
This is an integral system for placing Ball Grid and Chip Scale Packages using Infra Red heat source.
A time/temperature profile is developed to allow the heat transfer through the chip to reflow the solder balls. For leaded solder this is 183° and for lead free it is 217°. In order to do this, heat is applied to both top and bottom of the PCB and the device that has been positioned by means of the optical (split screen) system. The device is dipped in a well of flux, placed on the PCB, and cooked! Incorporated into this equipment is a camera that is focused on to the chip providing a real time view of the melting point, thus ensuring exact calibration is recorded. This equipment can also be used to place and rework QFN (Quad Flat No leads) packages.

ERSA IR650/PL650 Rework Station

Resolves BGA issues successfully every time with no possibility of damage due to overheating
The IR650/PL650 BGA rework equipment combines all the advantages of previous models and goes several steps further
. . . board sizes up to 460 x 600; integrated PCB supports as part of the system and five interactive sensors feeding back information to the control system; a selective reflow environment; replication of reflow profile system; reflow magnified 70 times so you see the double drop.

APR-5000-DZ Array Package Rework System

This system, from Oki, has been added to the range of complex package placement and rework equipment. This not only allows for the placement of BGA and CSP devices using hot gas, but also has the capability for reworking Package on Package (PoP) devices.

BGA and CSP Reballer

The Reballer enables BGA and CSP packages to be reballed, whether due to a change of solder metallurgy or simply down to reworking.

ERSA Scope Optical Inspection systems

Inspects BGA and CSP devices on PCBs and assists with fault diagnosis.
Using technology from the medical world, this system was specifically designed to inspect BGA and CSP devices on PCBs. It can look under the BGA or CSP by using a fibre optic stem and prism which bend the image by 90°. Software can assist with fault diagnosis and offer pictures of a range of typical faults and guidance for their rectification. In addition the system can be used with other lens systems to obtain close up photos of faults and anomalies.
This system includes a video camera connected to image processing software so that pictures can be stored, emailed or used as a reference source.

Vision Engineering Hawk Inspection System

Checks the thickness of copper plating, solder resist, fillet height component dimensions, etc.
A state-of-the-art microscope-based measurement system. Measuring in 3 axes to a resolution of 0.001mm with a wide range of advanced trigonometric functions and photographic capability. This extremely accurate 3 dimensional measuring system is used for checking thickness of copper plating, solder resist, fillet height component dimensions, etc.
Magnification is from 50 times to 500 times.
This system includes a video camera connected to image processing software so that pictures can be stored, emailed or used as a reference source.

X-Tek Revolution X-ray Inspection System

100 percent BGA and µBGA inspection, multilayer board inspection and PCB solder joint inspection
The Revolution provides the highest resolution and magnification possible within a compact system for manual and programmable inspection.
The transmission target enables samples to be placed within 250 microns of the focal spot providing up to 6000x system magnification.
The patented X-Tek Xi x-ray source allows x-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks.
Please note that a supplementary charge may apply to certain aspects of this machine's operations

Micro Sectioning Kit

This Kit consists of a Buehler Isomet precision sectioning saw, castable vacuuming system and a grinder/polisher, all of which allow companies to carry out detailed fault analysis on PCB and solder structures. The equipment also enables quality checks on PCBs and soldered joints, whilst joining and failure analysis applications are further enhanced, such as resolving wave solder fill issues, voids on solder joints, de-lamination of PCB substrates and under-fill penetration of staking adhesives.

Concoat CM 12 Contaminometer

Proves the Ionic cleanliness of PCBs in line with aerospace, Mil and IPC standards
Test system to measure Ionic contamination of PCBs in line with IPC J STD test method IPC TM 650. In order to prove Ionic cleanliness in line with aerospace, Mil and IPC standards, an analysis of test results can be produced on this device. The test method uses a solution of IPA and deionised water to wash the board and then measures the resistivity of the solution. This figure is then used as a cleanliness value.

Concoat MUST II Plus Solderability Test Machine

Ensures that components meet specified solderability parameters.
This equipment is used to carry out dip and globule solderability tests on PCB and components in line with IPC J STD 002 and 003 + MIL standards. This test is carried out in order to ensure that the component meets the solderability parameters of IPC J STD 002 and 003. Tests can be carried out on either leaded solder or lead-free solder. A component or PCB coupon is dipped into the molten solder and the resistance of surface tension is measured as the coupon is withdrawn from the solder.

Votsch VC 7018 Environmental Chamber

Proves that a product can withstand its operating environment.
This chamber provides a cyclic programme of testing from –70°C to +185°C with humidity from 10% to 98% above 10°C.
Devices can be tested under arduous working conditions in order to prove that a product can withstand its operating environment. Alternatively a product can be stressed to extremes of temperature and humidity on a cycle for hours, months or weeks in order to prove long-term reliability. Product can be powered and electronic measurements can be made during the processing via a portal in the chamber.

Fischerscope XDAL X Ray Spectrometer

Carries out rapid elemental analysis of electronic components and PCBs.
This instrument is able to carry out a rapid elemental analysis of electronic components and PCBs. The detailed analysis shows accurately the percentage of each element and can be used:
For verification of harmful elements in line with RoHS directive; and to determine the surface thickness of plating (ie, gold flash on pcbs).
A component lead may be examined to check if it is lead-free or an insulative sleeving can be checked for lead or cadmium content.
Detailed printouts of the full analysis are available.

LAND Cyclops Thermal Imaging Camera

Used to locate hot areas on PCBs and associated equipment.
By using the latest infra-red image processing this device is used to locate hot areas on PCBs and associated equipment. The temperature range of each colour portrayed can be set to as close as 2° giving a very accurate temperature picture of the device under scrutiny. This device can also be used to ensure that the electrical systems within a building are not running ‘hot’.

TWS 1250 3-zone Re-flow Oven

Accurately takes boards and components up to, and down from, re-flow temperature.
This production standard 3-zone re-flow oven is equipped with a fully programmable profile. A time-temperature profile is established to ensure that the PCB achieves the correct temperature to re-flow on the final heating stage.
This equipment is used in conjunction with the TWS RT 03 profiler to develop re-flow temperature profiles prior to production runs.

TWS RT 03 temperature profiler

Develops re-flow temperature profiles prior to production runs.
This re-flow oven temperature profile logging system with four thermo-couple sensors is used in conjunction with TWS 1250 3-zone re-flow oven in order to accurately take boards and components up to, and down from, the correct re-flow temperature.

PCB CAD design facility with Protel software
LPKF ProtoMat S62 Router

These items can be used as a set to produce one-off PCBs for test purposes.
Using these three devices a board can be designed, drilled, through-hole plated and tracks cut or routed.
The PCB CAD design facility with Protel software is a two-station PCB CAD facility that uses the sophisticated Protel software as a generic training program.
The ProtoMat S62 router can produce PCBs in flexible or rigid and complex/ultra fine pitch designs, and a multipress laminating press, which allows for eight-layer PCBs to be produced on a one-off basis.